Alumina Systems GmbH manufactures custom ceramic-metal composite components from the high-performance material aluminum oxide. In the semiconductor packaging sector, with chip diameters of up to 6 inches, Alumina Systems GmbH supplies around 60% of the global market and produces more than 200,000 components per year through a series soldering process. Core technologies such as dry pressing, metallization, passive and active soldering in a continuous furnace, and galvanization are also used to produce products for our other business areas, including vacuum, laser, X-ray, energy, plasma, medical, accelerator, and measurement technology.
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